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| Assembling the USB adapter&Power converter |
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The bare PCB. |
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Surface Mount Adhesive heat curable is applied for holding ICs in place during soldering operation. |
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Chips are placed. |
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Board goes to the oven to cure the adhesive. |
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The computer controlled oven is progammed for cure operation. |
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Solder paste is applied. |
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Remaining oven solderable SMD components are placed on board. |
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The board goes back to the oven. It is progammed for reflow soldering. |
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The board after reflow. |
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Cleaning is done several times along the assembly.. |
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Finished board. |
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Multiple tests are conducted along the wiring stage.
Once it is totally assembled and boxed, it undergo a burning test for 24 hours. |
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